NS3039 A mildly activated, resin-based flux formulation developed for a wide range of applications, leaving a pin-probable residue. The superior wetting ability results in bright, smooth, shiny solder joints. It also has very low post-process residue, which remains crystal clear and probable even at the elevated temperatures required for today's lead free solders. Reduces or eliminates voiding and also offers high humidity tolerance and a chemistry developed for use in air reflow.• 10g syringe pack• Suitable for lead-free solders• Probable residue

Specifications

Digitech