HIKMICRO Mini1 Smartphone Thermal Imaging Adapter. USB Type-C

Save $758.30
HikmicroSKU: MINI1

Price:
Sale price$347.10 NZD Regular price$1,105.40 NZD

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Expected Delivery Times

North Island - 2-6 Working Days

South Island - 3-10 Working Days

HIKMICRO Mini1 Smartphone Thermal Imaging Adapter. USB Type-C Thermal Resolution 160x120 (19,200 pixels) Temp Range -20 °C to 350 °C Accuracy ±2 °C or ±2%. FOV 50° × 38°. For Android Only

The Smartphone Module is designed to inspect electrical equipment and troubleshoot HVAC problems. Equipped with a functional thermal App for smartphones, the Smartphone Module enables you to get thermal imaging on your phone. 

Features:

  • Thermal resolution: 160 × 120 (19200 pixels)
  • NETD: < 40mK (@ 25°C, F#=1.0)
  • Accuracy: Max (±2°C, ±2%), applicable 60 sec after start-up when the ambient temperature is 15°C to 35°C and object temperature is above 0°C
  • USB Type-C Interface (Android)
  • 26g Weight

 

 

Specifications

 

 

Conductor Material SOLID-Bare Copper

24AWG

Insulation Material HDPE Diameter

0.87 ±0.03mm

Colour A. White-Blue, Blue B. White-Orange, Orange C. White-Green, Green D. White-Brown, Brown Rip-cord Yes Drain Wire No Sheath Thickness 0.55 ±0.05mm External O.D. 4.9  ±0.4mm. Surface Clean, Frap, Satiation Material

PVC (RoHS Complied) & CM rated (UL E225668)

Colour White Sheath Physical Properties    Before Aging Tensile Strength (Mpa) ≥13.5/Elongation (%) ≥150 Ageing Period (°C x hrs) 100°C x 24h x 7d After Aging Tensile Strength (Mpa) ≥12.5/Elongation (%) ≥125 Cold Blend (-20 ±2°C x4h) No visible cracks  Electrical Characteristics (20°C)    1.0-250.0MHz, Characteristic impedance (Ω)  100 ±15 1.0-250.0MHz, Delay Shew (ns/100m)  ≤45 DC Resistance (Ω/100m) max  11.0 DC Conductor Resistance Unbalance (%) max  5.0

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