Gigaybte B760M Aorus Elite (AX) Motherboard

GIGABYTE B760M AORUS ELITE AX DDR4 (rev. 1.0)

B760M AORUS ELITE (AX)

 

KEY FEATURE

·        Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors

·        Unparalleled Performance：Twin 12*+1+1 Phases Digital VRM Solution

·        Dual Channel DDR4：4*DIMMs with XMP Memory Module Support

·        Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors

·        Advanced Thermal Design & M.2 Thermal Guard ：To Ensure VRM Power Stability & M.2 SSD Performance

·        EZ-Latch Plus：M.2 Connectors with Quick Release & Screwless Design

·        Fast Networks：2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax

·        Extended Connectivity：Front USB-C® 10Gb/s, Rear USB-C® 20Gb/s, DP, HDMI

·        Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

·        Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

 

 

UNPARALLELED PERFORMANCE

With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming.

 

OUTSTANDING THERMAL DESIGN

GIGABYTE Motherboards' unparalleled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.

 

CONNECTIVITY

GABYTE Motherboards enable the ultimate connection experience with blazing data-transfer speeds through the next generation network, storage, and Wi-Fi connectivity.

 

PERSONALIZATION

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

 

ULTRA DURABLE

GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

 

Specifications
Audio
Chipset	Intel® B760 Express Chipset
Form Factor	Micro ATX Form Factor; 24.4cm x 24.4cm
I/O Connectors
Integrated CPU Graphics
LAN	Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Memory/Type/Bus/Max.	Support for DDR4 5333(O.C.) / 5133(O.C.) / 5000(O.C.) / 4933(O.C.) / 4800(O.C.) / 4700(O.C.) / 4600(O.C.) / 4500(O.C.) / 4400(O.C.) / 4300(O.C.) / 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2666 / 2400 / 2133 MT/s memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
Misc.
Other I/O Connectors
PCI Slots
Processor Support
Raid
RAM Type/Bus/Max.
Socket	LGA1700 socket: Support for the 13th and 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors* L3 cache varies with CPU * Please refer to "CPU Support List"
Storage Interface
USB Ports	Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2x2 support 1 x USB Type-C® port with USB 3.2 Gen 2 support, available through the internal USB header 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel 1 x USB 3.2 Gen 1 port on the back panel 4 x USB 2.0/1.1 ports available through the internal USB headers Chipset+USB 3.2 Gen 1 Hub: 4 x USB 3.2 Gen 1 ports (2 ports on the back panel, 2 ports available through the internal USB header) Chipset+USB 2.0 Hub: 4 x USB 2.0/1.1 ports on the back panel
Video Output
Warranty
Weight