Gigabyte B760M G X AX DDR4 Motherboard

GIGABYTE B760M GAMING X AX DDR4 (rev. 1.x)

B760M G X AX DDR4

 

KEY FEATURE

·        Intel® Socket LGA 1700：Support 13th and 12th Gen Series Processors

·        Unparalleled Performance：Hybrid 8+1+1 Phases Digital VRM Solution

·        Dual Channel DDR4：4*DIMMs XMP Memory Module Support

·        Next Generation Storage：2*PCIe 4.0 x4 M.2 Connectors

·        Advanced Thermal Design & M.2 Thermal Guard ：To Ensure VRM Power Stability & M.2 SSD Performance

·        EZ-Latch：PCIe 4.0x16 Slot with Quick Release Design

·        Fast Networks：2.5GbE LAN & Wi-Fi 6E 802.11ax

·        Extended Connectivity：Front USB-C® 10Gb/s, DP, HDMI

·        Smart Fan 6：Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP

·        Q-Flash Plus：Update BIOS Without Installing the CPU, Memory and Graphics Card

 

 

UNPARALLELED PERFORMANCE

With the fast-moving technology changes, GIGABYTE always follows the latest trends and provides customers with advanced features and latest technologies. GIGABYTE motherboards are equipped with upgraded power solution, latest storage standards and outstanding connectivity to enable optimized performance for gaming

 

OUTSTANDING THERMAL DESIGN

GIGABYTE Motherboards' Un-throttled performance is guaranteed by innovative and optimized thermal design to ensure the best CPU, Chipset, SSD stability and low temperatures under full load application and gaming performance.

 

 

PERSONALIZATION

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

 

ULTRA DURABLE

GIGABYTE Ultra Durable™ design provides product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

 

Specifications
Audio	Realtek® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out
Chipset	Intel® B760 Express Chipset
Form Factor	Micro ATX Form Factor; 24.4cm x 24.4cm
I/O Connectors	1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x S/PDIF Out header 1 x USB Type-C® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 2 x Thunderbolt™ add-in card connectors 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x serial port header 1 x reset button 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper
Integrated CPU Graphics
LAN	Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Memory/Type/Bus/Max.	Support for DDR4 5333(O.C.)/ 5133(O.C.)/ 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.)/ 4133(O.C.)/ 4000(O.C.)/ 3866(O.C.)/ 3800(O.C.)/ 3733(O.C.)/ 3666(O.C.)/ 3600(O.C.)/ 3466(O.C.)/ 3400(O.C.)/ 3333(O.C.)/ 3300(O.C.)/ 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MT/s memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
Misc.
Other I/O Connectors
PCI Slots
Processor Support
Raid
RAM Type/Bus/Max.
Socket
Storage Interface
USB Ports
Video Output
Warranty
Weight