Gigabyte B650M Aorus Pro AX 1.0 Motherboard

GIGABYTE B560M AORUS PRO AX (rev. 1.x)

 

No. B650M AORUS PRO AX 1.0

The B650M AORUS PRO AX comes with upgraded power solution, incredible cooling design, all PCIe 4.0 design and outstanding connectivity to elevate your gaming experience to the next level.

 

DIRECT POWER DESIGN

B560M AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.

 

ADVANCED THERMAL SOLUTION

B560M AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.

 

PERFORMANCE

With the best quality components and GIGABYTE R&D design capability, the B560M AORUS is a true beast among motherboards.

 

DEFINITIVE AESTHETICS

B560M AORUS PRO AX features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB/ Addressable RGB LEDs to make their PC more unique and stylish.

 

ULTRA DURABLE

GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560M AORUS motherboard and reinforce every slot to make each of them solid and durable.

 

NEXT GENERATION CONNECTIVITY

High Quality Onboard Audio Design

Delivers high quality sound resolution and sound expansion to create the most realistic sound effects for professional gamers.

 

 

Key Feature

·        Supports 11th and 10th Gen Intel® Core™ Series Processors

·        Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs

·        Direct 12+1 Phases Digital VRM Solution with 50A DrMOS

·        Shielded Memory Routing for Better Memory Overclocking

·        Fully Covered Thermal Design with High Coverage MOSFET Heatsinks

·        Onboard Intel® WiFi 6 802.11ax 2T2R & BT5 with AORUS Antenna

·        Blazing Fast Intel® 2.5GbE LAN with cFosSpeed

·        Dual Ultra-Fast NVMe PCIe 4.0*/3.0 x4 M.2 with Thermal Guard

·        SuperSpeed USB 3.2 Gen2x2 TYPE-C® delivers up to 20Gb/s Transfer Speeds

·        Pre-installed IO Shield for Easy and Quick Installation

·        RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips

·        Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP

·        Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card

 

 

Specifications
Audio	Realtek® Audio codec High Definition Audio 2/4/5.1/7.1-channel
Chipset	Intel® B560 Express Chipset
Form Factor	Micro ATX Form Factor; 24.4cm x 24.4cm
I/O Connectors
Integrated CPU Graphics	Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz * Support for HDMI 1.4 version and HDCP 2.3. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version, HDCP 2.3 (Graphics specifications may vary depending on CPU support.)
LAN	Intel®2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit)
Memory/Type/Bus/Max.	11th Generation Intel® Core™ i9/i7/i5 processors: Support for DDR4 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel® Core™ i9/i7 processors: Support for DDR4 2933/2666/2400/2133 MHz memory modules 10th Generation Intel® Core™ i5/i3 /Pentium®/Celeron® processors: Support for DDR4 2666/2400/2133 MHz memory modules 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
Misc.
Other I/O Connectors
PCI Slots
Processor Support
Raid
RAM Type/Bus/Max.
Socket
Storage Interface
USB Ports	Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen2x2 support 1 x USB 3.2 Gen2 Type-A ports (red) on the back panel 2 x USB 3.2 Gen1 ports on the back panel 2 x USB 2.0/1.1 ports on the back panel Chipset+USB 3.2 Gen 1 Hub: 1 x USB Type-C® port with USB 3.2 Gen1 support, available through the internal USB header 2 x USB 3.2 Gen1 ports available through the internal USB header Chipset+ 2 USB 2.0 Hubs: 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
Video Output
Warranty
Weight