Description
GIGABYTE B560 AORUS PRO AX (rev. 1.0)
No. B650 AORUS PRO AX 1.0
The B560 AORUS PRO AX comes with an upgraded power solution, incredible cooling design, all PCIe 4.0 design and outstanding connectivity to elevate your gaming experience to the next level.
DIRECT POWER DESIGN
B560 AORUS motherboard uses an 12+1 phases digital CPU power design which includes both digital PWM Controller and DrMOS. These 100% digital controller and additional 8 Solid-pin CPU Power Connectors offer incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from the new Intel 11th Gen CPU.
ADVANCED THERMAL SOLUTION
B560 AORUS uses high performance Fully Covered thermal design with high coverage MOSFET Heatsinks and thick thermal pad, providing ultimate MOSFET cooling performance for enthusiasts, overclockers and gamers.
PERFORMANCE
With the best quality components and GIGABYTE R&D design capability, the B560 AORUS is a true beast among motherboards.
NEXT GENERATION CONNECTIVITY
A high-end product needs to be future-proof so your system stays up-to-date with the latest technology. B560 AORUS PRO AX provides all next generation network, storage, and WIFI connectivity to keep you up to speed.
DEFINITIVE AESTHETICS
B560 AORUS PRO AX features RGB FUSION 2.0 and offers users the option to control onboard, external light strips, and/or AORUS devices with RGB / Addressable RGB LEDs to make their PC more unique and stylish.
ULTRA DURABLE
GIGABYTE is reputable for its product durability and high quality manufacturing process. Needless to say, we use the best components we can find for the B560 AORUS motherboard and reinforce every slot to make each of them solid and durable.
GIGABYTE BIOS & APP CENTER
Good software goes hand in hand with perfect hardware. GIGABYTE motherboard bundled several useful and intuitive software to help users to control every aspect of motherboard.
Key Feature
Supports 11th and 10th Gen Intel® Core™ Series Processors
Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
Direct 12+1 Phases Digital VRM Solution with 50A DrMOS
Shielded Memory Routing for Better Memory Overclocking
Fully Covered Thermal Design with High Coverage MOSFET Heatsinks
Onboard Intel® WiFi 6 802.11ax 2T2R & BT5 with AORUS Antenna
Blazing Fast Intel® 2.5GbE LAN
Triple Ultra-Fast NVMe PCIe 4.0/3.0 x4 M.2 with Thermal Guards
SuperSpeed USB 3.2 Gen2x2 TYPE-C delivers up to 20Gb/s transfer speeds
Front USB3.2 Gen1 Type-C® for Connecting device
Pre-installed IO Shield for easy and quick installation
RGB FUSION 2.0 with Multi-Zone Addressable LED Light Show Design, Support Addressable LED & RGB LED Strips
Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP
Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card
Specifications | |
---|---|
Audio | Realtek® ALC4080 codec High Definition Audio 2/4/5.1/7.1-channel Support for S/PDIF Out |
Chipset | Intel® B560 Express Chipset |
Form Factor | ATX Form Factor; 30.5cm x 24.4cm |
I/O Connectors | |
Integrated CPU Graphics | Integrated Graphics Processor-Intel® HD Graphics support: 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 1 x HDMI port, supporting a maximum resolution of 4096x2160@30 Hz * Support for HDMI 1.4 version and HDCP 2.3. (Graphics specifications may vary depending on CPU support.) |
LAN | Intel® 2.5GbE LAN chip (2.5 Gbit/1 Gbit/100 Mbit) |
Memory/Type/Bus/Max. | 11th Generation Intel® Core™ i9/i7/i5 processors: Support for DDR4 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200 / 3000 / 2933 / 2800 / 2666 / 2400 / 2133 MHz memory modules 10th Generation Intel® Core™ i9/i7 processors: Support for DDR4 2933/2666/2400/2133 MHz memory modules 10th Generation Intel® Core™ i5/i3 /Pentium®/Celeron® processors: Support for DDR4 2666/2400/2133 MHz memory modules 4 x DDR4 DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.) |
Misc. | |
Other I/O Connectors | |
PCI Slots | |
Processor Support | |
Raid | |
RAM Type/Bus/Max. | |
Socket | |
Storage Interface | |
USB Ports | Chipset: 1 x USB Type-C® port on the back panel, with USB 3.2 Gen 2x2 support 1 x USB Type-C® port with USB 3.2 Gen 1 support, available through the internal USB header 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel 2 x USB 2.0/1.1 ports on the back panel Chipset+2 USB 3.2 Gen 1 Hubs: 6 x USB 3.2 Gen 1 ports (4 ports on the back panel, 2 ports available through the internal USB header) Chipset+1 USB 2.0 Hub: 4 x USB 2.0/1.1 ports available through the internal USB headers |
Video Output | |
Warranty | |
Weight |
Specifications
Delivery
Expected delivery times:
- North Island 1-4 workings days
- South Island 2-5 working days
Expected Delivery Times
North Island - 2-6 Working Days
South Island - 3-10 Working Days